MIL-PRF-31032/2: Printed Wiring Board, Rigid, Single and Double Layer, Woven E-Glass Reinforced Thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.
Printed Circuit Board/Printed Wiring Board, General Specification for
标题描述:
印刷电路板/印刷线路板,通用规范
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MIL-PRF-31032/2: Printed Wiring Board, Rigid, Single and Double Layer, Woven E-Glass Reinforced Thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.