|
描述 |
标准 |
MIL-HDBK-816 |
涵盖范围 |
The primary objective of this document is to provide guidelines and easy to follow procedures for the preparation of detailed device specifications for the procurement of microcircuits and semiconductor devices where radiation Hardness Assurance (RHA) is required. The guidelines are applicable to MIL-M-38510, MIL-PRF-38534, MIL-PRF-38535, and MIL-PRF-19500 microcircuit and semiconductor device detailed specifications, Standard Microcircuit Drawings (SMDs) as well as other contractor prepared specifications such as Source Control Drawings (SOCD), Selected Item Drawings (SID), and Specification Control Drawings (SCD). Recommended procedures are provided for characterizing the radiation response of a part and for obtaining post-irradiation post-irradiation end-point limits for qualification and Lot Acceptance Tests (LAT). |
描述 |
Guidelines for Developing Radiation Hardness Assurance Device Specifications |
分类归属 |
59GP |
文档状态 |
有效
|
文档日期 |
2007-04-11 |
审查日期 |
2012-04-09 |
文档类型 |
Department of Defense Handbook |
文档注释 |
It is recommended that you use Adobe Reader v7.0 or higher for optimal download performance;older versions should continue to work, but downloading large files may appear to take longer, so please be patient in those cases. |
起草机构 |
CC |
编制机构 |
DLA Land and Maritime |
协调级别 |
Full |
陆军管理 |
US Army Communications Electronics Command |
海军管理 |
Space and Naval Warfare Systems Command |
空军管理 |
Space and Missile Systems Center |
国防后勤局管理 |
DLA Land and Maritime |