Samtec高速板对板连接器
夹层系统具有集成接地层，高密度阵列，ExaMAX®底板互连，坚固的EdgeRate®系统和高达28+ Gbps的高性能。
Board-to-board systems to 28+ Gbps performance featuring integral ground planes, rugged Edge Rate® contacts, slim body and low profile stack heights.
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential.
Performance: Up to 14.0 GHz /28 Gbps
Integral ground/power plane
Connector to connector retention options
Vertical, perpendicular, and coplanar applications
Contacts: Up to 180 I/Os
Stack height: 5.00 mm - 25.00 mm
Samtec Q Pairs® connectors are designed for high-speed board-to-board applications where signal integrity is essential.
Performance: Up to 10.5 GHz / 21 Gbps
Optimized for 100 ohm systems
Integral ground/power plane
Stack height: 5.00-25.00 mm
Contacts: Up to 100 pairs
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Performance: Up to 15 GHz / 30 Gbps
Rugged Edge Rate® contacts
Integral ground/power plane
Up to 156 positions
Slim footprint (less than 5.00 mm wide)
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
Performance: Up to 8.5 GHz / 17 Gbps
Increased insertion depth
Dual stage hot pluggable
Integral ground/power plane
Shielded option available
Power and RF ends options
Contacts: Up to 208 I/Os
Stack height: 10.00 mm - 16.00 mm
Rugged Edge Rate® contact systems optimized for signal integrity performance.
Edge Rate® contacts optimized for signal integrity performance
Robust when "zippered" during unmating
0.80 mm or 0.50 mm pitch systems
Stack heights from 7 mm to 16 mm
0.50 mm pitch system for up to 40% PCB space savings
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
10 stack height options from 5 mm to 12 mm
Audible click when mated
Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
Up to 100 contacts
These 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact systems optimized for signal integrity performance
Supports 28+ Gbps applications
Solder ball technology for simplified processing
Even thinner 2-row version and additional stack heights in development
Board-to-board systems with rugged Edge Rate® contacts, increased insertion depths, and rugged designs for contact protection during mating and unmating.
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
Performance: Up to 8.5 GHz / 17 Gbps
Increased insertion depth
Dual stage hot pluggable
Integral ground/power plane
Shielded option available
Power and RF ends options
Contacts: Up to 208 I/Os
Stack height: 10.00 mm - 16.00 mm
Rugged Edge Rate® contact systems optimized for signal integrity performance.
Edge Rate® contacts optimized for signal integrity performance
Robust when "zippered" during unmating
0.80 mm or 0.50 mm pitch systems
Stack heights from 7 mm to 16 mm
0.50 mm pitch system for up to 40% PCB space savings
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Performance: Up to 15 GHz / 30 Gbps
Rugged Edge Rate® contacts
Integral ground/power plane
Up to 156 positions
Slim footprint (less than 5.00 mm wide)
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
10 stack height options from 5 mm to 12 mm
Audible click when mated
Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
Up to 100 contacts
High-speed floating contact system minimizes mating alignment errors.
Provides 0.50 mm (.0197") float in X and Y directions
Ideal for multiple connectors on a board
Up to 60 floating contacts
Choice of body height and right-angle design
High-density grid arrays on a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.
ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
Enables 56 Gbps electrical performance on 2.00 mm column pitch
Allows designers to optimize density or minimize board layer count
Two reliable points of contact, even when subjected to angled mating
Meets Telcordia GR-1217 CORE specification
Individual signal wafers with staggered differential pair design; 72 or 40 pairs
One-piece embossed ground structure on each signal wafer to reduce crosstalk
Lowest mating force on the market: 0.36 N max per contact
Stub free mating
Press fit termination
Power and Guide Modules available
These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.
Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
Performance up to 18 GHz/pair
Up to 500 I/Os in open pin field design
1.27 mm (.050") pitch and space saving 0.80 mm pitch
Rugged Edge Rate® contact system
Can be "zippered" during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Product™ (E.L.P.™) standards
7 - 17 mm stack heights
Vertical, right-angle, press-fit
Elevated systems to 40 mm
85 ohm systems
VITA 47, VITA 57, Pismo 2 certified
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
0.80 mm (.0315") pitch grid
50% board space savings versus .050" (1.27 mm) pitch SEARAY™
Performance: Up to 17.5 GHz / 35 Gbps
Rugged Edge Rate® contact system
Up to 500 I/Os
7 mm and 10 mm stack heights
Solder charge terminations for ease of processing
Samtec 28+ Gbps Solution
Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
This three-piece system features crosstalk-canceling technology delivering 28+ Gbps performance at elevated stack heights.
Three-piece system
Crosstalk canceling technology
28+ Gbps solution
35 mm standard stack height aids in system airflow
Three-piece system reduces thermal mass during processing
50, 100, and 150 differential pairs
18 mm – 40 mm stack heights available
1.50 mm x 1.75 mm pitch
Dual sourced By Hirose®
Dedicated differential pair, high-density arrays designed for performance up to a terabit per connector.
Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
No return paths needed
Fewer board layers required
Performance: Up to 4 GHz per pair (up to a terabit per connector)
Up to 168 usable pairs
10 mm stack height
Lower insertion / extraction forces
Solder crimp termination
Elevated high-density open pin field arrays up to 35 mm stack heights.
Application specific capability to stack heights from 20 mm to 35 mm
Open pin field design
Performance: Up to 9 GHz / 18 Gbps
Integrated guide posts to minimize contact damage when mating and unmating
Solder charge terminations for ease of processing
2.00 mm x 1.20 mm pitch
Up to 299 I/Os
Intermateable with Molex HD Mezz Arrays
HD Mezz is a trademark of Molex Incorporated
Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.
4 mm, 4.5 mm, 5 mm stack heights
Up to 320 I/Os
4, 6 and 8 row designs
.050" (1.27 mm) pitch
Dual beam contact system
Solder crimp termination for ease of processing
Performance up to 18.5 GHz / 37 Gbps
High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.
1.27 mm and 2 mm standard body heights
1.00 mm pitch
Dual compression or single compression with solder balls
100 – 400 total pins
Ideal for low cost board stacking, module-to-board and LGA interfaces
Minimizes thermal expansion issues
Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.
1 mm standard body height
Dual compression contacts
Single compression with solder ball
Performance up to 20 GHz / 40 Gbps
0.80 mm or 1.00 mm pitch standard
Highly customizable system
Ultra-fine pitch, ultra-low profile and ultra-slim body interconnects with 28+ Gbps performance.
Ultra slim, ultra low profile and ultra fine pitch interconnects.
Ultra fine pitch – 0.40 mm and 0.50 mm
Ultra low stack down to 2.00 mm
Slim body design for increased board space savings
Rugged Edge Rate® contact systems optimized for signal integrity performance.
Edge Rate® contacts optimized for signal integrity performance
Robust when "zippered" during unmating
0.80 mm or 0.50 mm pitch systems
Stack heights from 7 mm to 16 mm
0.50 mm pitch system for up to 40% PCB space savings
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
10 stack height options from 5 mm to 12 mm
Audible click when mated
Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
Up to 100 contacts
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
0.80 mm (.0315") pitch grid
50% board space savings versus .050" (1.27 mm) pitch SEARAY™
Performance: Up to 17.5 GHz / 35 Gbps
Rugged Edge Rate® contact system
Up to 500 I/Os
7 mm and 10 mm stack heights
Solder charge terminations for ease of processing
Samtec 28+ Gbps Solution
Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.
4 mm, 4.5 mm, 5 mm stack heights
Up to 320 I/Os
4, 6 and 8 row designs
.050" (1.27 mm) pitch
Dual beam contact system
Solder crimp termination for ease of processing
Performance up to 18.5 GHz / 37 Gbps
Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.
1 mm standard body height
Dual compression contacts
Single compression with solder ball
Performance up to 20 GHz / 40 Gbps
0.80 mm or 1.00 mm pitch standard
Highly customizable system
Samtec’s 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 signal integrity optimized Edge Rate® contacts in a low profile, slim body design.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact systems optimized for signal integrity performance
Supports 28+ Gbps applications
Solder ball technology for simplified processing
Even thinner 2-row version and additional stack heights in development
Cost saving, high-performance RF solutions for board-to-board and cable-to-board applications.
IsoRate® is a high-isolation interconnect system that can offer substantial savings over traditional RF connectors at approximately half the cost.
Half the cost of traditional RF at virtually the same performance
Edge Rate® contacts for high-isolation
50 ohm board-to-board systems
50 ohm full ganged system or ganged with industry standard end 2 options
Positive latching available
Three piece "bullet" style systems offering misalignment compensation.
Compensates for misalignment in X & Y directions
Frequency range (SMP): DC to 40 GHz
Frequency range (AFI): DC to 6 GHz
Bullet adaptors allow for flexible connections
Samtec's ganged micro-miniature high-performance solutions are on a 5.00 mm pitch and available as board-to-board or cable-to-board systems.
Performance up to 6 GHz
50 ohm and 75 ohm solutions
Full ganged system or ganged with industry standard end 2 options
Micro-miniature, rugged contacts
Optional captive panel screws
Single or double-ended cable assemblies
Optional threaded inserts
Full line of interconnects designed to support serial speeds of 28 Gbps or more.
Samtec has developed a full line of connector products that are designed to support serial speeds of 28 Gbps or more.
0.40 mm, 0.50 mm, 0.80 mm, 0.635 mm, 1.00 mm, .050" or 2.00 mm pitch
Pin counts from 10 to 500
Stack heights from 1 mm to 30 mm
Vertical and horizontal orientations
