HI-1573CDM 我司库存300只
Holt集成电路通过真正的单芯片双3.3V收发器继续支持MIL-STD-1553数据总线。新型HI-1573采用成熟的设计技术和最新的模拟CMOS技术，当以100％占空比进行传输时，仅消耗340mW的功率，同时仍可为总线提供所需的功率。
通过将RXENA或RXENB设置为低电平，也可以独立地将每组接收器输出强制为总线空闲状态（HI-1573上的逻辑“ 0”或HI-1574上的逻辑“ 1”）。
该器件采用20引脚小型SOIC封装，在器件底部带有集成的金属散热片，即使在最苛刻的环境下也可确保足够的散热。 HI-1573尺寸仅为0.5 x 0.4英寸，厚度仅为0.1英寸，为该功能提供了最小的电路板占板面积，并且即使对于PCMCIA应用也足够小。
该设备可与标准MIL-STD-1553变压器一起使用，直接耦合的匝数比为1：2.5，而变压器耦合的总线连接的匝数比为1：1.79 / 1：1.4。
HI-1573和HI-1574的样品可通过小型热增强塑料SOIC以及传统的20引脚陶瓷DIP封装轻松获得。
特征
符合MIL-STD-1553A＆B和ARINC 708A
3.3V单电源供电
CMOS技术可实现低待机功耗
采用20引脚塑料ESOIC（热增强）封装的最小封装
最大功耗小于0.5W
提供DIP和小型ESOIC封装选项
提供工业和扩展温度范围
工业标准引脚配置
应用领域
MIL-STD-1553接口
智能弹药
店铺管理
传感器接口
仪器仪表
测验设备
| Part # | Package Description | Temp Range | Flow | Moisture Sensitivity Level | RoHS Compliant |
| HI-1573CDI | 20 Pin Ceramic Side-Brazed DIP | -40°C to +85°C | I | N/A | Yes |
| HI-1573CDM | 20 Pin Ceramic Side-Brazed DIP | -55°C to +125°C | M | N/A | No |
| HI-1573CDT | 20 Pin Ceramic Side-Brazed DIP | -55°C to +125°C | T | N/A | Yes |
| HI-1573PCI | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -40°C to +85°C | I | 3 | No |
| HI-1573PCIF | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -40°C to +85°C | I | 3 | Yes |
| HI-1573PCM | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -55°C to +125°C | M | 3 | No |
| HI-1573PCMF | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -55°C to +125°C | M | 3 | Yes |
| HI-1573PCT | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -55°C to +125°C | T | 3 | No |
| HI-1573PCTF | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -55°C to +125°C | T | 3 | Yes |
| HI-1573PSI | 20 Pin Plastic ESOIC - WB | -40°C to +85°C | I | 1 | No |
| HI-1573PSIF | 20 Pin Plastic ESOIC - WB | -40°C to +85°C | I | 1 | Yes |
| HI-1573PSM | 20 Pin Plastic ESOIC - WB | -55°C to +125°C | M | 1 | No |
| HI-1573PSMF | 20 Pin Plastic ESOIC - WB | -55°C to +125°C | M | 1 | Yes |
| HI-1573PST | 20 Pin Plastic ESOIC - WB | -55°C to +125°C | T | 1 | No |
| HI-1573PSTF | 20 Pin Plastic ESOIC - WB | -55°C to +125°C | T | 1 | Yes |
| HI-1574CDI | 20 Pin Ceramic Side-Brazed DIP | -40°C to +85°C | I | N/A | Yes |
| HI-1574CDM | 20 Pin Ceramic Side-Brazed DIP | -55°C to +125°C | M | N/A | No |
| HI-1574CDT | 20 Pin Ceramic Side-Brazed DIP | -55°C to +125°C | T | N/A | Yes |
| HI-1574PCI | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -40°C to +85°C | I | 3 | No |
| HI-1574PCIF | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -40°C to +85°C | I | 3 | Yes |
| HI-1574PCM | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -55°C to +125°C | M | 3 | No |
| HI-1574PCMF | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -55°C to +125°C | M | 3 | Yes |
| HI-1574PCT | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -55°C to +125°C | T | 3 | No |
| HI-1574PCTF | 44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN) | -55°C to +125°C | T | 3 | Yes |
| HI-1574PSI | 20 Pin Plastic ESOIC - WB | -40°C to +85°C | I | 1 | No |
| HI-1574PSIF | 20 Pin Plastic ESOIC - WB | -40°C to +85°C | I | 1 | Yes |
| HI-1574PSM | 20 Pin Plastic ESOIC - WB | -55°C to +125°C | M | 1 | No |
| HI-1574PSMF | 20 Pin Plastic ESOIC - WB | -55°C to +125°C | M | 1 | Yes |
| HI-1574PST | 20 Pin Plastic ESOIC - WB | -55°C to +125°C | T | 1 | No |
| HI-1574PSTF | 20 Pin Plastic ESOIC - WB | -55°C to +125°C | T | 1 | Yes |
