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首页 > 订购代码 > PJC TECHNOLOGIES, INC.
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电子组件 MIL-PRF-31032/4: Printed Wiring Board, Rigid-Flex or Flexible, Multilayer with Plated Holes, With or Without Stiffiners, for Soldered Part Mounting.
电子组件 MIL-PRF-31032/5: Printed Wiring Board, Rigid, Multilayered, Thermoplastic or Thermoplastic and Thermosetting Resin Base Material, with Plated through Holes, for High Frequency Applications.
电子组件 MIL-PRF-31032/5: Printed Wiring Board, Rigid, Multilayered, Thermoplastic or Thermoplastic and Thermosetting Resin Base Material, with Plated through Holes, for High Frequency Applications.
电子组件 MIL-PRF-31032/6: Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or Without Plated through Holes, for High Frequency Applications.
电子组件 MIL-PRF-31032/6: Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or Without Plated through Holes, for High Frequency Applications.
电子组件 MIL-PRF-31032/6: Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or Without Plated through Holes, for High Frequency Applications.
电子组件 MIL-PRF-31032/2: Printed Wiring Board, Rigid, Single and Double Layer, Woven E-Glass Reinforced Thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.
电子组件 MIL-PRF-31032/2: Printed Wiring Board, Rigid, Single and Double Layer, Woven E-Glass Reinforced Thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.

共计18条记录