MIL-PRF-31032/2: Printed Wiring Board, Rigid, Single and Double Layer, Woven E-Glass Reinforced Thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.,电子组件,VIASYSTEMS TECHNOLOGIES CORP, LLC,西安福川电子科技有限公司
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首页 > 订购代码 > 政府订货代码 > MIL-PRF-31032/2: Printed Wiring Board, Rigid, Single and Double Layer, Woven E-Glass Reinforced Thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.